- turn table
- Ni Line taping
- clean
- acid
- Ni plating
- Ni Line tape strip
- Ag Line taping
- Cu strike
- Ag strike
- Ag plating
- Ni,Ag Line tape strip
- Drying
- turn table
Creat Ni+Ag plating by placing masking tape twice by using a laminator (1time)
Create a uniform and dense rough copper surface layer by applying oxide etching treatment to the bare copper surface.
Initial Cu1+ is oxidized,
and soluble Cu2+ induces
metal adhesion layer formation.
Growth and dissolution proceed simultaneously,
and the adhesion layer reaches maximum
thickness in an equilibrium state.
